Martin Corfield

Contact

• workRoom 511 Tower Building
  University Park
  Nottingham
  NG7 2RD
  UK
• work0115 84 66890
• martin.corfield@nottingham.ac.uk

Recent Publications

• PA AGYAKWA, MR CORFIELD, L YANG, JF LI, VMF MARQUES, C M JOHNSON, 2011. Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling Microelectronics Reliability. 51(2), 406-415
• AGYAKWA, P., CORFIELD, M., LI, J., JOHNSON, C., HOGG, S., LIOTTI, E. and LOH, W., 2010. Unusual Observations in the Wear-out of High Purity Aluminium Wire Bonds under Extended Range Passive Thermal Cycling IEEE Transactions on Device and Materials Reliability.

• View all publications

• PA AGYAKWA, MR CORFIELD, L YANG, JF LI, VMF MARQUES, C M JOHNSON, 2011. Microstructural evolution of ultrasonically bonded high purity Al wire during extended range thermal cycling Microelectronics Reliability. 51(2), 406-415
• AGYAKWA, P., CORFIELD, M., LI, J., JOHNSON, C., HOGG, S., LIOTTI, E. and LOH, W., 2010. Unusual Observations in the Wear-out of High Purity Aluminium Wire Bonds under Extended Range Passive Thermal Cycling IEEE Transactions on Device and Materials Reliability.