Contact
Biography
I am an experimental materials scientist with several years' experience in the characterisation of fine-scale microstructures relating to fatigue and creep, including aerospace and power plant structures. My current role within the PEMC group, which I've held since 2007, is centred on elucidating the degradation mechanisms and failure physics of power electronics packaging components, including ultrasonically bonded wire interconnects, solder and sintered nanosilver die-attachments. My expertise includes exploring and quantifying three-dimensional damage morphologies using 3D X-ray computed microtomography methodologies and mapping damage by using nanoindentation properties. I also explore alternative sensory modalities for perceiving materials properties and exploring materiality.
I am also an interdisciplinary researcher, interested in the humanistic aspects of materials and manufacturing. I am interested in how political, historical and cultural contexts influence what and how materials and manufacturing methods are used.
Expertise Summary
My expertise and research interests include: ultrasonic joining, microscopy & microstructures, 3D X-ray tomography, micromechanical properties, deformation & fracture, metallurgy, fatigue & creep, soldering, sintering and joining technologies, visualisation and image analysis, sound, sonification, arts-informed research design and community engaged research.