Mark Johnson

Contact

• workPEMC Building
  Jubilee Campus
  Wollaton Road
  Nottingham
  NG8 1BB
  UK
• work0115 846 8685
• fax0115 951 5616
• mark.johnson@nottingham.ac.uk

Biography

Professor C Mark Johnson received the BA degree in engineering and the PhD degree in electrical engineering from the University of Cambridge, UK, in 1986 and 1991 respectively.

From 1990 to 1992 he was a Research Associate at the University of Cambridge and in 1992 he was appointed Lecturer at the University of Newcastle, UK, where his research included the design, analysis and characterisation of power semiconductor devices, resonant power conversion and instrumentation.

From 1998 to 2001 he managed the UK national programme on Silicon Carbide electronics and in 2000 he became Reader of Power Electronics at the University of Newcastle. In 2003, Professor Johnson was appointed as Rolls-Royce/RAEng Research Professor of Power Electronic Systems at the University of Sheffield and in 2006 he was appointed to a personal chair at the University of Nottingham, where he leads research into power semiconductor devices, power device packaging, reliability, and thermal management, power module technologies and power electronic applications.

He is a member of the executive committee of the UK Innovative Electronics Manufacturing Research Centre (IeMRC) and is Director of the EPSRC Centre for Power Electronics.

He is a member of the Power Electronics, Machines and Control research group.

Research Summary

Professor Johnson is currently researching:

• Power semiconductor devices

• Power device packaging, reliability, and thermal management

• Power module technologies

• Power electronic applications

• Renewable energy technologies; distributed generation

• Thermoacoustics.

Selected Publications

• LI, J.F., AGYAKWA, P.A. and JOHNSON, C.M., 2011. Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process Acta Materialia. 59(3), 1198-1211
• AGYAKWA, P.A., CORFIELD, M.R., LI, J.F., LOH, W.-S., LIOTTI, E., HOGG, S.C. and JOHNSON, C.M., 2010. Unusual observations in the wear-out of high-purity aluminium wire bonds under extended range passive thermal cycling IEEE Transactions on Device and Materials Reliability. 10(2), 254-262
• MUSALLAM, M. and JOHNSON, C.M., 2010. Real-time compact thermal models for health management of power electronics IEEE Transactions on Power Electronics. 25(6), 1416-1425
• LI, J.F., AGYAKWA, P.A. and JOHNSON, C.M., 2010. Kinetics of Ag₃Sn growth in Ag-Sn-Ag system during transient liquid phase soldering process Acta Materialia. 58(9), 3429-3443

• View all publications

• SALA, G., DE BONIS, G., COSTABEBER, A., TANI, A., JOHNSON, M. and CLARE, J., 2023. Development and Validation of a Smart Architecture for Thyristor Valves IEEE Journal of Emerging and Selected Topics in Power Electronics. 1-1
• STRATTA, ANDREA, GOTTARDO, DAVIDE, DI NARDO, MAURO, ESPINA, JORDI, DE LILLO, LILIANA, EMPRINGHAM, LEE and JOHNSON, MARK C., 2022. Optimal Integrated Design of a Magnetically Coupled Interleaved H-Bridge IEEE TRANSACTIONS ON POWER ELECTRONICS. 37(1), 724-737
• BRUNI, S., MISTRY, P. J., JOHNSON, M. S., BERNASCONI, A., CARBONI, M., FORMAGGIONI, D., CARRA, G., MACCHIAVELLO, S., FERRANTE, E., KAISER, I., VIÑOLAS, J. and MARAZZI, I., 2022. A vision for a lightweight railway wheelset of the future: Proceedings of the Institution of Mechanical Engineers, Part F: Journal of Rail and Rapid Transit Proceedings of the Institution of Mechanical Engineers, Part F: Journal of Rail and Rapid Transit.
• P.J. MISTRY, M.S. JOHNSON, C.A. MCROBIE and I.A. JONES, 2021. Design of a lightweight multifunctional composite railway axle utilising coaxial skins Journal of Composites Science. 5(3), 77
• KE LI, PAUL LEONARD EVANS, CHRISTOPHER MARK JOHNSON, ARNAUD VIDET and NADIR IDIR, 2021. A GaN-HEMT Compact Model Including Dynamic RDSon Effect for Power Electronics Converters Energies. 14(8), 2092
• STRATTA, ANDREA, MOUAWAD, BASSEM, ANTONINI, MATTIA, DE LILLO, LILIANA, EMPRINGHAM, LEE and JOHNSON, MARK C., 2021. Heterogeneous Integration of Magnetic Component Windings on Ceramic Substrates IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS. 9(4), 3867-3876
• DAI, JINGRU, LI, JIANFENG, AGYAKWA, PEARL, CORFIELD, MARTIN and JOHNSON, CHRISTOPHER MARK, 2021. Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY. 21(4), 536-543
• SAEED, RASHA, EMPRINGHAM, LEE, DE LILLO, LILIANA, AHMADI, BEHZAD and JOHNSON, C. MARK, 2021. Modelling a Modified Equivalent Circuit of a Single-Layer, Solenoidal Inductor at High Frequency In: 2021 23rd European Conference on Power Electronics and Applications (EPE'21 ECCE Europe). P.1-P.10
• SUROJIT SEN, PAUL L EVANS and C MARK JOHNSON, 2020. Multi-frequency averaging (MFA) model of a generic electric vehicle powertrain suitable under variable frequency of averaging developed for remote operability IET Electrical Systems in Transportation.
• VIDET, A., LI, K., IDIR, N., EVANS, P. and JOHNSON, M., 2020. Analysis of GaN Converter Circuit Stability Influenced by Current Collapse Effect
• LI, K., VIDET, A., IDIR, N., EVANS, P. and JOHNSON, M., 2020. Modelling GaN-HEMT Dynamic ON-state Resistance in High Frequency Power Converter
• DIMARINO, C., MOUAWAD, B., JOHNSON, M., WANG, MEIYU, TAN, Y-S., LU, G-Q., BOROYEVICH, D. and BURGOS, R., 2020. Design and Experimental Validation of a Wire-bond-less 10 kV SiC MOSFET Power Module IEEE Journal of Emerging and Selected Topics in Power Electronics. 8(1), 381 - 394
• LI, KE, VIDET, ARNAUD, IDIR, NADIR, EVANS, PAUL LEONARD and JOHNSON, CHRISTOPHER MARK, 2020. Accurate Measurement of Dynamic ON-State Resistances of GaN Devices Under Reverse and Forward Conduction in High Frequency Power Converter IEEE TRANSACTIONS ON POWER ELECTRONICS. 35(9), 9650-9660
• STRATTA, A., AHMADI, B., MOUAWAD, B., ROBERTSON, S., DE LILLO, L., EMPRINGHAM, L. and JOHNSON, M., 2019. 3D structure design of magnetic ferrite cores using gelcasting and pressure-less sintering process AIP ADVANCES. 9(3),
• AGYAKWA, P., DAI, JINGRU, LI, JIANFENG, MOUAWAD, B., YANG, L., CORFIELD, M. and JOHNSON, M., 2019. Three-dimensional damage morphologies of thermomechanically deformed sintered nanosilver die attachments for power electronics modules Journal of Microscopy.
• DIMARINO, C., MOUAWAD, B., JOHNSON, M., BOROYEVICH, D. and BURGOS, R., 2019. 10-kV SiC MOSFET Power Module With Reduced Common-Mode Noise and Electric Field IEEE Transactions on Power Electronics. 35(6), 6050 - 6060
• YANG, L., LI, K., DAI, J., CORFIELD, M., HARRIS, A., PACIURA, K., O'BRIEN, J. and JOHNSON, C.M., 2018. Electrical performance and reliability characterization of a SiC MOSFET power module with embedded decoupling capacitors IEEE Transactions on Power Electronics.
• LI, KE, EVANS, PAUL and JOHNSON, MARK, 2018. SiC/GaN power semiconductor devices: a theoretical comparison and experimental evaluation under different switching conditions IET ELECTRICAL SYSTEMS IN TRANSPORTATION. 8(1), 3-11
• LI, JIANFENG, CASTELLAZZI, A., ELEFFENDI, M.A., GURPINAR, E., JOHNSON, C.M. and MILLS, L., 2018. A Physical RC Network Model for Electrothermal Analysis of a Multichip SiC Power Module IEEE Transactions on Power Electronics. 33(3), 2494 - 2508
• LI, JIANFENG, DAI, J. and JOHNSON, C.M., 2018. Comparison of power cycling reliability of flexible PCB interconnect smaller/thinner and larger/thicker power devices with topside Sn-3.5Ag solder joints Microelectronics. 84, 55-65
• LI, KE., EVANS, P. and JOHNSON, C.M., 2018. Characterisation and Modeling of Gallium Nitride Power Semiconductor Devices Dynamic On-State Resistance IEEE Transactions on Power Electronics. 33(6), 5262 - 5273
• AHMADI, B., ESPINA, J., DE LILLO, L., ABEBE, R., EMPRINGHAM, L. and JOHNSON, C.M., 2018. Next generation integrated drive: A novel thermal and electrical integration technique for high power density converters used in automotive drive systems In: 9th International Conference on Power Electronics, Machines and Drives, PEMD 2018.
• ZHANG, HUI, LI, JIANFENG, DAI, JINGRU, CORFIELD, MARTIN, LIU, XUEJIAN, LIU, YAN, HUANG, ZHENGREN and JOHNSON, CHRISTOPHER MARK, 2018. Improved Reliability of Planar Power Interconnect With Ceramic-Based Structure IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS. 6(1), 175-187
• JOHNSON, MARK, WILSON, PETER R., EMPRINGHAM, LEE and DE LILLO, LILIANA, 2018. IEEE ITRW Working Group Position Paper-Packaging and Integration Unlocking the full potential of wide-bandgap devices IEEE POWER ELECTRONICS MAGAZINE. 5(2), 26-33
• DE LILLO, L., AHMADI, B., EMPRINGHAM, L., JOHNSON, M., ESPINA, J. and ABEBE, R., 2018. Next Generation Integrated Drive, NGID: A Novel Approach to Thermal and Electrical Integration of High Power Density Drives in Automotive Applications
• SEN, SUROJIT, EVANS, PAUL L. and JOHNSON, C. MARK, 2018. Multi-Frequency Averaging (MFA) Model of Electric-Hybrid Powertrain Suitable for Variable Frequency Operation Applied in Geographically-Distributed Power Hardware-in-the-Loop (GD-PHiL) Simulation 2018 IEEE VEHICLE POWER AND PROPULSION CONFERENCE (VPPC).
• MOUAWAD, B., DI MARINO, C., LI, JIANFENG, SKURIAT, R. and JOHNSON, M., 2018. Packaging Technology for a Highly Integrated 10kV SiC MOSFET Module In: ISPS 2018 - INTERNATIONAL SEMINAR ON POWER SEMICONDUCTORS.
• LI, KE, EVANS, P. and JOHNSON, M., 2018. Novel GaN Power Transistor Substrate Connection to Minimize Common Mode Current In: WiPDA 2018 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia.
• DAI, JINGRU, MOUAWAD, B., LI, JIANFENG and JOHNSON, M., 2018. Thermal performance and reliability of high temperature SiC die attachments on direct cooling stacked Si3N4 substrates In: WiPDA 2018 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia.
• DI MARINO, C., MOUAWAD, B., SKURIAT, R., LI, KE, XU, Y., JOHNSON, M. and BOROYEVICH, D., 2018. A Wire-bond-less 10 kV SiC MOSFET Power Module with Reduced Common-mode Noise and Electric Field In: PCIM 2018 - International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management.
• MOUAWAD, B., DI MARINO, C., SKURIAT, R., LI, JIANFENG and JOHNSON, M., 2018. Development of a Highly Integrated 10 kV SiC MOSFET Power Module with a Direct Jet Impingement Cooling System In: ISPSD - IEEE 30th International Symposium on Power Semiconductor Devices and Ics.
• LI, JIANFENG, CASTELLAZZI, A., ELEFFENDI, M.A., GURPINAR, E., JOHNSON, C.M. and MILLS, L., 2017. A Physical RC Network Model for Electro-Thermal Analysis of a Multichip SiC Power Module IEEE Transactions on Power Electronics.
• LIN, X., LI, J. and JOHNSON, M., 2017. Design and construction of a co-planar power bus interconnect for low inductance switching
• LI, K, EVANS, P and JOHNSON, C M, 2017. Characterisation and modelling of gallium nitride power semiconductor devices dynamic on-state resistance IEEE Transactions on Power Electronics. In Press,
• ELEFFENDI, MOHD. AMIR and JOHNSON, C. MARK, 2017. In-Service Diagnostics for Wire-Bond Lift-off and Solder Fatigue of Power Semiconductor Packages IEEE TRANSACTIONS ON POWER ELECTRONICS. 32(9), 7187-7198
• KE LI, PAUL EVANS and MARK JOHNSON, 2017. Using multi time-scale electro-thermal simulation approach to evaluate SiC-MOSFET power converter in virtual prototyping design tool In: Control and Modeling for Power Electronics (COMPEL), 2017 IEEE 18th Workshop on.
• LI, JIANFENG, YAQUB, IMRAN, CORFIELD, MARTIN and JOHNSON, CHRISTOPHER MARK, 2017. Interconnect Materials Enabling IGBT Modules to Achieve Stable Short-Circuit Failure Behavior IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY. 7(5), 734-744
• ESPINA, J., AHMADI, B., EMPRINGHAM, L., DE LILLO, L. and JOHNSON, C.M., 2017. Highly-integrated power cell for high-power wide band-gap power converters In: 3rd International Future Energy Electronics Conference and ECCE Asia (IFEEC 2017 - ECCE Asia).
• ZHANG, ZHE and JOHNSON, C. MARK, 2017. Suppression of Electromagnetic Interference using Screening and Shielding Techniques within the Switching Cells 2017 IEEE INTERNATIONAL WORKSHOP ON INTEGRATED POWER PACKAGING (IWIPP).
• DI MARINO, C., BOROYEVICH, D., BURGOS, R. and JOHNSON, C.M., 2017. Design and development of a high-density, high-speed 10 kV SiC MOSFET module In: 19th European Conference on Power Electronics and Applications (EPE'17 ECCE Europe).
• DI MARINO, C., JOHNSON, M., MOUAWAD, B., LI, JIANFENG, BOROYEVICH, D., BURGOS, R., LU, G.Q., WANG, MARIANNE and YANG, ZHENWEN, 2017. Design and Development of a Novel, High-Density, High-Speed 10 kV SiC MOSFET Module In: CPES 2017 - Centre for Power Electronics Systems Conference.
• GANJAVI, AMIN, CHRISTOPHER, EDWARD, JOHNSON, C. MARK and CLARE, JON, 2017. A New Analysis for Finding the Optimum Power Rating of Low Voltage Distribution Power Electronics Based on Statistics and Probabilities 2017 19TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS (EPE'17 ECCE EUROPE).
• GANJARVI, A., CHRISTOPHER, E., JOHNSON, M. and CLARE, J., 2017. A Study on Probability of Distribution Loads Based on Expectation Maximization Algorithm In: ISGT 2017 - 8th Conference on Innovative Smart Grid Technologies.
• DAI, JINGRU, LI, JIANFENG, AGYAKWA, P. and JOHNSON, M., 2017. Time-efficient sintering processes to attach power devices using nanosilver dry film Journal of Microelectronics and Electronic Packaging. 2017(HiTen),
• DI MARINO, C., BOROYEVICH, D., BURGOS, R. and JOHNSON, M., 2017. Design and Development of a 10 kV, 60 A SiC MOSFET Module In: CPES 2017 - Centre for Power Electronics Systems.
• ELEFFENDI, M.A. and JOHNSON, C.M., 2016. Application of Kalman Filter to Estimate Junction Temperature in IGBT Power Modules IEEE Transactions on Power Electronics. 31(2), 7073633
• EVANS, PAUL L., CASTELLAZZI, ALBERTO and JOHNSON, C. MARK, 2016. Design Tools for Rapid Multidomain Virtual Prototyping of Power Electronic Systems IEEE TRANSACTIONS ON POWER ELECTRONICS. 31(3), 2443-2455
• LI, J. F., AGYAKWA, P. A. and JOHNSON, C. M., 2016. Response to comments on "A numerical method to determine interdiffusion coefficients of Cu6Sn5 and Cu3Sn intermetallic compounds" INTERMETALLICS. 69, 128-130
• EFFAH, FRANCIS B., WATSON, ALAN J., JI, CHAO, AMANKWAH, EMMANUEL, JOHNSON, C. MARK, DAVIDSON, COLIN and CLARE, JON, 2016. Hybrid HVDC circuit breaker with self-powered gate drives IET POWER ELECTRONICS. 9(2), 228-236
• ARJMAND, E., AGYAKWA, P.A., CORFIELD, M., LI, J. and JOHNSON, C.M., 2016. Predicting Lifetime of Thick Al Wire Bonds Using Signals Obtained From Ultrasonic Generator IEEE Transactions on Components, Packaging and Manufacturing Technology. (In Press.)
• AGYAKWA, P.A., YANG, L., ARJMAND, E., EVANS, P., CORFIELD, M. and JOHNSON, C.M., 2016. Damage Evolution in Al Wire Bonds Subjected to a Junction Temperature Fluctuation of 30 K Journal of Electronic Materials. 45(7), 3659–3672
• MOUAWAD, B., LI, J., CASTELLAZZI, A. and JOHNSON, C.M., 2016. Hybrid half-bridge package for high voltage application In: 28th International Symposium on Power Semiconductor Devices and ICs, ISPSD 2016.
• LI, JIANFENG, YAQUB, I. and JOHNSON, C.M., 2016. Selection of materials for IGBT modules to achieve stable short circuit failure behaviour In: PCIM Asia 2016.
• ARJMAND, E., AGYAKWA, P.A., CORFIELD, M., LI, JIANFENG, MOUAWAD, B. and JOHNSON, C.M., 2016. A thermal cycling reliability study of ultrasonically bonded copper wires Microelectronics Reliability. 59, 126-133
• MOUAWAD, B., LI, JIANFENG, CASTELLAZZI, A., FRIEDRICHS, P. and JOHNSON, C.M., 2016. Low parasitic inductance multi-chip SiC devices packaging technology In: 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe).
• MOUAWAD, B., LI, JIANFENG, CASTELLAZZI, A. and JOHNSON, C.M., 2016. Reliable integration of a high performance multi-chip half-bridge SiC power module In: 6th Electronics System-Integration Technology Conference (ESTC’16).
• MOUAWAD, B., LI, JIANFENG, CASTELLAZZI, A., JOHNSON, C.M., ERLBACHER, T. and FRIEDRICHS, P., 2016. Low inductance 2.5kV packaging technology for SiC switches In: 9th International Conference on Integrated Power Electronics Systems.
• LI, K., EVANS, P. and JOHNSON, C.M., 2016. SiC/GaN Power Semiconductor Devices Theoretical Comparison and Experimental Evaluation In: Vehicle Power and Propulsion Conference (VPPC) 2016.
• LI, K., EVANS, P. and JOHNSON, C.M., 2016. SiC and GaN Power Transistors Switching Energy Evaluation in Hard and Soft Switching Conditions In: IEEE WIPDA 2016.
• LI, K., EVANS, P. and JOHNSON, C.M., 2016. Developing Power Semiconductor Device Model for Virtual Prototyping of Power Electronics Systems In: 13th IEEE Vehicle Power and Propulsion Conference.
• JI, CHAO, WATSON, ALAN J., CLARE, JON C. and JOHNSON, C. MARK, 2016. A Novel Full Soft-switching Resonant Power Converter for Mid-feeder Voltage Regulation of Low Voltage Distribution Network In: 18th European Conference on Power Electronics and Applications (EPE'16 ECCE Europe).
• LI, KE, EVANS, PAUL and JOHNSON, MARK, 2016. GaN-HEMT Dynamic ON-state Resistance characterisation and Modelling 2016 IEEE 17th Workshop on Control and Modeling for Power Electronics (COMPEL).
• ELEFFENDI, MOHD. AMIR, YANG, LI, AGYAKWA, PEARL and JOHNSON, C. MARK, 2016. Quantification of cracked area in thermal path of high-power multi-chip modules using transient thermal impedance measurement MICROELECTRONICS RELIABILITY. 59, 73-83
• R. ABEBE, G. VAKIL, G. LO CALZO, T. COX, S. LAMBERT, M. JOHNSON, C. GERADA and B. MECROW, 2016. Integrated motor drives: state of the art and future trends IET Electric Power Applications. 10(8), 757-771
• JIANFENG LI, CHRISTOPHER MARK JOHNSON, CYRIL BUTTAY, WISSAM SABBAH, STÉPHANE AZZOPARDI, 2015. Bonding strength of multiple SiC die attachment prepared with sintering of Ag nanoparticles Journal of Materials Processing Technology. 215, 299-308
• MUSALLAM, MAHERA, YIN, CHUNYAN, BAILEY, CHRISTOPHER and JOHNSON, MARK, 2015. Mission Profile-Based Reliability Design and Real-Time Life Consumption Estimation in Power Electronics IEEE TRANSACTIONS ON POWER ELECTRONICS. 30(5), 2601-2613
• FAZELI, A., JOHNSON, C.M., SUMNER, M. and CHRISTOPHER, E., 2015. Investigating the impact of varying the number of distributed energy resources on controlling the power flow within a microgrid In: IEEE Power and Energy Society Innovative Smart Grid Technologies Conference, ISGT 2015.
• FAZELI, A., JOHNSON, C.M., SUMNER, M. and CHRISTOPHER, E., 2015. A novel stochastic modelling approach for electric vehicle charging power and energy requirements In: IEEE Power and Energy Society Innovative Smart Grid Technologies Conference, ISGT 2015.
• YAQUB, I., LI, J. and JOHNSON, C.M., 2015. Dependence of overcurrent failure modes of IGBT modules on interconnect technologies Microelectronics Reliability. 55(12), 2596-2605
• FAZELI, A., SUMNER, M., JOHNSON, C.M. and CHRISTOPHER, E., 2015. Investigating the impact of varying the number of distributed energy resources on controlling the power flow within a microgrid In: IEEE Power and Energy Society General Meeting, PESGM 2015.
• ABEBE, R., VAKIL, G., LO CALZO, G., COX, T., GERADA, C. and JOHNSON, C.M., 2015. FEA Based Thermal Analysis of Various Topologies for Integrated Motor Drives In: IECON 2015.
• EVANS, P., CASTELLAZZI, A. and JOHNSON, C.M., 2015. A design tool for rapid, multi-domain virtual prototyping of power electronic systems In: 2015 IEEE Energy Conversion Congress and Exposition, ECCE.
• LAMBERT, S., MECROW, B., ABEBE, R., VAKIL, G. and JOHNSON, C.M., 2015. Integrated Drives for Transport - A Review of the Enabling Thermal Management Technology In: 2015 IEEE Vehicle Power and Propulsion Conference, VPPC.
• LAMBERT, S., MECROW, B., ABEBE, R., VAKIL, G. and JOHNSON, C.M., 2015. Integrated Drives for Transport - A Review of the Enabling Electronics Technology In: 2015 IEEE Vehicle Power and Propulsion Conference, VPPC 2015.
• ELEFFENDI, M.A. and JOHNSON, C.M., 2015. Evaluation of on-state voltage VCE(ON) and threshold voltage Vth for real-time health monitoring of IGBT power modules In: 17th European Conference on Power Electronics and Applications, EPE-ECCE Europe 2015.
• LI, JIANFENG, JOHNSON, C.M., BUTTAY, C., SABBAH, W. and AZZOPARDI, S., 2015. Bonding strength of multiple SiC die attachment prepared by sintering of Ag nanoparticles Journal of Materials Processing Technology. 215(1), 299-308
• MUSALLAM, M., YIN, C., BAILEY, C. and JOHNSON, C.M, 2014. Application of coupled electro-thermal and physics-of-failure-based analysis to the design of accelerated life tests for power modules Microelectronics Reliability. 54(1), 172-181
• LI, J.F., AGYAKWA, P.A. and JOHNSON, C.M, 2014. Suitable Thicknesses of Base Metal and Interlayer, and Evolution of Phases for Ag/Sn/Ag Transient liquid-phase Joints Used for Power Die Attachment Journal of Electronic Materials. 1-13
• TEERAKAWANICH, N. and JOHNSON, C. W., 2014. Design optimization of quasi-active gate control for series-connected power devices IEEE Transactions on Power Electronics. 29(6), 2705-2714
• ARJMAND, E., AGYAKWA, P.A. and JOHNSON, C.M., 2014. Reliability of thick Al wire: A study of the effects of wire bonding parameters on thermal cycling degradation rate using non-destructive methods Microelectronics Reliability.
• YUN WANG, JIANFENG LI, PEARL AGYAKWA, CHRISTOPHER MARK JOHNSON, SHUGUANG LI, 2014. Surface profiles of printed Ag nanoparticle paste and their implication on the quality of sintered joints In: Proceedings of the 7th International Conference on Integrated Power Electronics Systems. 193-199
• JIANFENG LI, IMRAN YAQUB, MARTIN CORFIELD, PEARL AGYAKWA, CHRISTOPHER MARK JOHNSON, 2014. Comparison of thermo-mechanical reliability of high-temperature bonding materials for attachment of SiC devices In: Proceedings of the 7th International Conference on Integrated Power Electronics Systems. 489-495
• JIANFENG LI, PEARL AGYAKWA, PAUL EVANS, CHRISTOPHER MARK JOHNSON, YIMIN ZHAO, YIBO WU, KIM EVANS, 2014. Packaging / assembling technologies for a high performance SiC-based planar power module In: Greener Aviation Conference.
• J.F. LI, P.A. AGYAKWA, C.M. JOHNSON, 2014. Interdiffusion coefficients of binary multiphase systems with consideration of variation in Molar volumes International Journal of Materials Engineering and Technology. 12(1), 25-36
• ADANE SOLOMON, JIANFENG LI, ALBERTO CASTELLAZZI, CHRISTOPHER MARK JOHNSON, 2014. Integrated Half-Bridge Switch using 70μm Thin Devices and Hollow Interconnects IEEE Transactions on Industry Applications.
• LI, J., CASTELLAZZI, A., DAI, T., CORFIELD, M., SOLOMON, A.K. and JOHNSON, C.M., 2014. Built-in reliability design of highly integrated solid-state power switches with metal bump interconnects IEEE Transactions on Power Electronics. 30(5), 6895288
• EVANS, P., CASTELLAZZI, A. and JOHNSON, C.M., 2014. A Multi-Disciplinary Virtual Prototyping Design Tool for Power Electronics In: 8th International Conference on Integrated Power Electronics Systems, CIPS 2014.
• ELEFFENDI, M.A. and JOHNSON, C.M., 2014. Thermal path integrity monitoring for IGBT Power Electronics Modules In: 8th International Conference on Integrated Power Electronics Systems, CIPS 2014.
• JOHNSON, C.M. and BAILEY, C., 2014. An Integrated Approach to Thermal Management of Power Electronic Modules In: Therminic 2014.
• YANG, L., AGYAKWA, P.A. and JOHNSON, C.M., 2014. Calibration of a novel microstructural damage model for wire bonds IEEE Transactions on Device and Materials Reliability. 14(4), 6891277
• EVANS, P., CASTELLAZZI, A., JOHNSON, C.M., LU, H. and BAILEY, C., 2014. The optimization of thermal performance in power electronics modules In: Electronic Packaging Technology Conference, EPTC 2014.
• WANG, Y., LI, J., AGYAKWA, P.A., JOHNSON, C.M. and LI, S., 2014. Quantitative microstructure characterization of Ag nanoparticle sintered joints for power die attachment Molecular Crystals and Liquid Crystals. 604(1), 11-26
• FAZELI, A., SUMNER, M., CHRISTOPHER, E. and JOHNSON, C.M., 2014. Power flow control for power and voltage management in future smart energy communities In: 3rd Renewable Power Generation Conference, RPG 2014.
• AGYAKWA, P.A., MARQUES, V.M.F., CORFIELD, M.R., LI, J.F., YANG, L. and JOHNSON, C.M., 2013. Room-Temperature Nanoindentation Creep of Thermally Cycled Ultrasonically Bonded Heavy Aluminum Wires Journal of Electronic Materials. 1-8
• EVANS, P.L., CASTELLAZZI, A. and JOHNSON, C.M., 2013. Automated fast extraction of compact thermal models for power electronic modules IEEE Transactions on Power Electronics. 28(10), 4791-4802
• TEERAKAWANICH, N. and JOHNSON, C.M., 2013. A new resonant gate driver with bipolar gate voltage and gate energy recovery In: 28th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2013. 2424-2428
• SKURIAT, R., LI, J.F., AGYAKWA, P., MATTEY, N., EVANS, P. and JOHNSON, C.M., 2013. Degradation of thermal interface materials for high-temperature power electronics applications Microelectronics Reliability. (In Press.)
• LI, J.F., AGYAKWA, P. and JOHNSON, C.M., 2013. A numerical method to determine interdiffusion coefficients of Cu 6Sn5 and Cu3Sn intermetallic compounds 40, 50-59
• YANG, L., AGYAKWA, P. and JOHNSON, C.M., 2013. Physics-of-failure lifetime prediction models for wire bond interconnects in power electronic modules IEEE Transactions on Device and Materials Reliability. 13(1), 6392232
• DAVIES, R., FAZELI, A., OE, S.P., SUMNER, M., JOHNSON, C.M. and CHRISTOPHER, E., 2013. Energy management research using emulators of renewable generation and loads In: 2013 IEEE PES Innovative Smart Grid Technologies Conference, ISGT 2013.
• EVANS, P., CASTELLAZZI, A., BOZHKO, S. and JOHNSON, C.M., 2013. Automatic Design Optimisation for Power Electronics Modules Based on Rapid Dynamic Thermal Analysis In: 15th European Conference on Power Electronics and Applications (EPE-ECCE 2013).
• ARJMAND, E., AGYAKWA, P. and JOHNSON, C.M., 2013. Methodology for Identifying Wire Bond Process Quality Variation Using Ultrasonic Current Frequency Spectrum In: 15th European Conference on Power Electronics and Applications (EPE-ECCE 2013).
• LI, J.F., AGYAKWA, P.A. and JOHNSON, C.M., 2012. Effect of traceAl on growth rates of intermetallic compound layers between Sn-based solders and Cu substrate Journal of Alloys and Compounds. 545, 70-79
• J.F. LI, A. CASTELLAZZI, A. SOLOMON and C.M. JOHNSON, 2012. Reliable Integration of Double-Sided Cooled Stacked Power Switches Based on 70 um Thin IGBTs and Diodes In: 7th International Conference on Integrated Power Electronics Systems. 131-136
• SAHA, C.R., RILEY, P.H., PAUL, J., YU, Z., JAWORSKI, A.J., JOHNSON, C.M., 2012. Halbach array linear alternator for thermo-acoustic engine Sensors and Actuators, A: Physical. 178(179), 187
• DANG, H.Q.S., CORFIELD, M.R., CASTELLAZZI, A., JOHNSON, C.M. and WHEELER, P., 2012. Repetitive high peak current pulsed discharge film-capacitor reliability testing Microelectronics Reliability. 52(9-10), 2301-2305
• AHMED, A., SHADROKH, Y., COULBECK, L., CASTELLAZZI, A. and JOHNSON, C.M., 2012. A closed-loop IGBT non-destructive tester Microelectronics Reliability. 52(9/10), 2358-2362
• AHMED, A., CASTELLAZZI, A., COULBECK, L. and JOHNSON, M.C., 2012. Circuit design and experimental test of a high power IGBT non-destructive tester Microelectronics Reliability. 52(11), 2609-2616
• AHMED, A., CASTELLAZZI, A., COULBECK, L. and JOHNSON, C.M., 2012. Design and test of a high power IGBT non-destructive tester In: IEEE International Symposium on Industrial Electronics. 292-297
• AHMED, A., COULBECK, L., CASTELLAZZI, A. and JOHNSON, C.M., 2012. Transient Analysis and Simulation of A High Power IGBT Non-Destructive Tester In: 2012 15th International Power Electronics and Motion Control Conference (EPE/PEMC).
• JOHNSON, C.M., CASTELLAZZI, A., SKURIAT, R., EVANS, P., JIANFENG, LI. and AGYAKWA, P., 2012. Integrated high power modules In: 2012 7th International Conference on Integrated Power Electronics Systems (CIPS).
• MUSALLAM, MAHERA and JOHNSON, C. MARK, 2012. An Efficient Implementation of the Rainflow Counting Algorithm for Life Consumption Estimation IEEE TRANSACTIONS ON RELIABILITY. 61(4), 6328300
• TEERAKAWANICH, N., EVANS, P. and JOHNSON, C.M., 2012. In: 2012 15th International Power Electronics and Motion Control Conference (EPE/PEMC).
• AGYAKWA, P.A., YANG, L., CORFIELD, M. and JOHNSON, C.M., 2012. A non-destructive study of crack development during thermal cycling of Al wire bonds using x-ray computed tomography In: 8th International Conference on Integrated Power Electronics Systems, CIPS 2014.
• MUSALLAM, MAHERA and JOHNSON, C MARK, 2011. Impact of different control schemes on the life consumption of power electronic modules for variable speed wind turbines In: 14th European Conference on Power Electronics and Applications (EPE 2011).
• EVANS, PAUL, TEERAKAWANICH, NITHIPHAT and JOHNSON, C MARK, 2011. Active control of series connected, voltage driven power devices using a single gate drive In: 14th European Conference on Power Electronics and Applications (EPE 2011).
• AGYAKWA, PA, CORFIELD, MR, YANG, L, LI, JF, MARQUES, VMF and JOHNSON, CM, 2011. Microstructural Evolution Of Ultrasonically Bonded High Purity Al Wire During Extended Range Thermal Cycling Microelectronics Reliability. 51(2), 406-415
• LI, J.F., AGYAKWA, P.A. and JOHNSON, C.M., 2011. Interfacial reaction in Cu/Sn/Cu system during the transient liquid phase soldering process Acta Materialia. 59(3), 1198-1211
• YANG, L., AGYAKWA, P.A. and JOHNSON, C.M., 2011. A time-domain physics-of-failure model for the lifetime prediction of wire bond interconnects Microelectronics Reliability. 51(9-11), 1882-1886
• FAZELI, A., GILLOTT, M., JOHNSON, M. and SUMNER, M., 2011. Investigating the effects of incorporating seasonal variation in a domestic active occupancy model In: 3rd International Conference on Sustainability in Energy and Buildings, SEB'11. 447-455
• CASTELLAZZI, A., SOLOMON, A., AGYAKWA, P., LI, J., TRENTIN, A. and JOHNSON, C. M., 2010. High power density, low stray inductance, double sided cooled matrix-converter type switch In: 2010 International Power Electronics Conference (IPEC).
• AGYAKWA, P.A., CORFIELD, M.R., LI, J.F., LOH, W.-S., LIOTTI, E., HOGG, S.C. and JOHNSON, C.M., 2010. Unusual observations in the wear-out of high-purity aluminium wire bonds under extended range passive thermal cycling IEEE Transactions on Device and Materials Reliability. 10(2), 254-262
• MATTEY, N., SKURIAT, R., LI, J., AGYAKWA, P., EVANS, P. and JOHNSON, C.M., 2010. Thermal and mechanical design optimization of a pressure-mounted base-plate-less high temperature power module In: Electronic System-Integration Technology Conference (ESTC), 13-16 Sept. 2010.
• WIJEKOON, T., ABDESSELAM, F., CASTELLAZZI, A., JOHNSON, M., PICCO, N. and WHEELER, P., 2010. Optimum Component Technology Selection for an Expulsive Wing De-Icing System In: PEMD 2010.
• EVANS, P., CASTELLAZZI, A., CARASTRO, F. and JOHNSON, C.M., 2010. A computationally efficient electro-thermal modelling technique for coupled Multi-Disciplinary Analysis of Multi-Chip Power Modules In: 2010 22nd International Symposium on Power Semiconductor Devices & IC's (ISPSD), 6-10 June 2010. 297-300
• ABDESSELAM, F., WIJEKOON, T., CASTELLAZZI, A., JOHNSON, M. and WHEELER, P., 2010. Design of an expulsive de-icing system for avionic applications: preliminary study and functional tests In: International Conference on Industrial Technology (ICIT), 2010.
• MUSALLAM, M., JOHNSON, C.M., YIN, C., BAILEY, C. and MERMET-GUYENNET, M., 2010. Real-time life consumption power modules prognosis using on-line rainflow algorithm in metro applications In: Energy Conversion Congress and Exposition (ECCE), 2010.
• RILEY, P.H., SAHA, C. and JOHNSON, C. M., 2010. Designing a Low-Cost, Electricity-Generating Cooking Stove At: Technology and Society Magazine
• MUSALLAM, M. and JOHNSON, C.M., 2010. Real-time compact thermal models for health management of power electronics IEEE Transactions on Power Electronics. 25(6), 1416-1425
• YIN, C.Y., LU, H., MUSALLAM, M., BAILEY, C. and JOHNSON, C.M, 2010. In-service reliability assessment of solder interconnect in power electronics modules In: Prognostics and Health Management Conference, 2010. PHM '10. 1-5
• EVANS, P. and JOHNSON, M., 2010. Fast Extraction of Dynamic Thermal Impedance for Multi-Chip Power Modules In: 6th International Conference on Integrated Power Electronics Systems (CIPS), 2010.
• LI, J.F., AGYAKWA, P.A. and JOHNSON, C.M., 2010. Kinetics of Ag₃Sn growth in Ag-Sn-Ag system during transient liquid phase soldering process Acta Materialia. 58(9), 3429-3443
• LI, JF, AGYAKWA, PA and JOHNSON, CM, 2010. A Fixed-Grid Numerical Modelling Of Transient Liquid Phase Bonding And Other Diffusion-Controlled Phase Changes Journal Of Materials Science. 45(9), 2340-2350
• LI, J.F., AGYAKWA, P.A., JOHNSON, C.M., ZHANG, D., HUSSAIN, T. and MCCARTNEY, D.G., 2010. Characterization and solderability of cold sprayed Sn-Cu Coatings on Al and Cu substrates Surface and Coatings Technology. 204(9-10), 1395-1404
• YIN, C., LU, H., MUSALLAM, M., BAILEY, C. and JOHNSON, C.M., 2010. Prognostic reliability analysis of power electronics modules International Journal of Performability Engineering. 6(5), 513-524
• CARASTRO, F., CLARE, J., CASTELLAZZI, A., JOHNSON, M., BLAND, M. and WHEELER, P, 2009. Power device reliability assessment in high pulsed power resonant converters In: ECCE 2009.
• CARASTRO, F., BLAND, M., CASTELLAZZI, A., CLARE, J. C., JOHNSON, C. M. and WHEELER, P. W., 2009. Investigation of the electro-thermal stress affecting IGBT modules in high-pulsed power resonant converters In: IET European Pulsed Power Conference, 2009. 1-4
• CARASTRO, F., CLARE, J. C., BLAND, M. J., JOHNSON, C. M. and WHEELER, P. W., 2009. Development and power device reliability assessment of resonant pulsed power converters for RF applications In: High Power RF Technologies, 2009. 1-5
• MUSALLAM, M., JOHNSON, M., YIN, C., LU, H. and BAILEY, C., 2009. Real-Time Comparison of Power Module Failure Modes under In-Service Conditions In: 13th European Conference on Power Electronics and Applications, EPE 2009.
• CASTELLAZZI, A., JOHNSON, M. and MERMET-GUYENNET, M., 2009. Computation of realistic 3D temperature fields in the circuit simulation of power components and systems In: IMPAS 2009.
• CASTELLAZZI, A., JOHNSON, M., PITON, M. and MERMET-GUYENNET, M, 2009. Experimental analysis and modeling of multi-chip IGBT modules short-circuit behavior In: IEEE 6th International Power Electronics and Motion Control Conference, 2009. IPEMC '09. 285-290
• SOLOMALA, P., CASTELLAZZI, A., MERMET-GUYENNET, M. and JOHNSON, M., 2009. New technology and tool for enhanced packaging of semiconductor power devices In: IEEE International Symposium on Industrial Electronics, 2009. ISIE 2009. 2020-2025
• SKURIAT, R. and JOHNSON, M., 2009. Direct Substrate Cooling of Power Electronics In: EPE 2009.
• HUA LU, WEI-SUN LOH, BAILEY, C. and JOHNSON, C.M., 2009. Computer modelling analysis of the globtop’s effects on aluminium wirebond reliability In: Electronics System-Integration Technology Conference, 1-4 Sept. 2008.
• RIZVI, M.J., SKURIAT, R., TILFORD, T., BAILEY, C., JOHNSON, C.M. and LU, H, 2009. Modelling of jet-impingement cooling for power electronics In: 10th International Conference on Thermal, Mechanical and Multi-Physics simulation and Experiments in Microelectronics and Microsystems, 2009. EuroSimE 2009. 1-5
• NIKITINA, I., VASSILEVSKI, K., HORSFALL, A., WRIGHT, N., O'NEILL, A. G., RAY, S. K., ZEKENTES, K. and JOHNSON, C. M., 2009. Phase composition and electrical characteristics of nickel silicide Schottky contacts formed on 4H-SiC SEMICONDUCTOR SCIENCE AND TECHNOLOGY. 24(5), 055006
• CARASTRO, F., CASTELLAZZI, A., CLARE, J. C., JOHNSON, M., BLAND, M. and WHEELER, P. W., 2009. Reliability considerations in pulsed power resonant conversion MICROELECTRONICS RELIABILITY. 49(9-11), 1352-1357
• HUA LU, RIDOUT, S., BAILEY, C., WEI SUN LOH, AGYAKWA, P. and JOHNSON, M., 2008. Computer simulation of crack propagation in power electronics module solder joints In: Electronic Packaging Technology & High Density Packaging, 28-31 July 2008.
• JOHNSON, C.M, CLARE, J. and ASHER, G, 2008. Challenges for Power Electronics in Future Electricity Networks In: International Conference and Exhibiotion on High Temperature Electronics (HiTEC 2008). 133-140
• YIN, C.Y., LU, H., MUSALLAM, M., BAILEY, C. and JOHNSON, C.M, 2008. A Physics-of-failure based Prognostic Method for Power Modules In: Electronics Packaging Technology Conference, 2008. 1190-1195
• YIN, C.Y., LU, H., MUSALLAM, M., BAILEY, C. and JOHNSON, C.M., 2008. A prognostic assessment method for power electronics modules In: Electronics System-Integration Technology Conference, 2008, 1-4 Sept. 2008.
• MUSALLAM, M., JOHNSON, C.M., CHUNYAN YIN, HUA LU and BAILEY, C., 2008. Real-time life expectancy estimation in power modules In: Electronics System-Integration Technology Conference, 1-4 Sept. 2008.
• MUSALLAM, M. and JOHNSON, C.M., 2008. Monitoring through-life thermal path degradation using real time thermal models In: Power Electronics Specialists Conference, 15-19 June 2008.
• SKURIAT, ROBERT, JOHNSON, C. M. and , 2008. Thermal performance of baseplate and direct substrate cooled power modules In: 4th IET Conference on Power Electronics, Machines and Drives, 2008. 548-552
• HUA LU, WEI-SUN LOH, BAILEY, C. and JOHNSON, C.M, 2008. Computer Simulation of Aluminium Wirebonds with Globtop in Power Electronics Modules In: Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. 348-351
• LOH, W. S., NG, B. K., NG, J. S., SOLOVIEV, S. I., CHA, H.-Y., SANDVIK, P. M., JOHNSON, C. M., DAVID, J. P. R. and , 2008. Impact Ionization Coefficients in 4H-SiC IEEE Transactions on Electron Devices. 55(8), 1984-1990
• MUSALLARN, MAHERA, ACARNLEY, PAUL P., JOHNSON, C. MARK, PRITCHARD, LEN and PICKERT, VOLKER, 2008. Power electronic device temperature estimation and control in pulsed power and converter applications CONTROL ENGINEERING PRACTICE. 16(12), 1438-1442
• BUTTAY,C., JOHNSON, C.M., RASHID, J., UDREA, F., AMARATUNGA, G.A.J., TAPPIN, P., WRIGHT, N., IRELAND, P., YAMAMOTO, T., TAKEUCHI, Y. and MALHAN, R.K., 2007. High temperature direct double side cooled inverter module for hybrid electric vehicle application Materials Science Forum. 556-557, 709-712
• MUSALLAM, M., ACARNLEY, P. P., JOHNSON, C. M., PRITCHARD, L. and PICKERT, V., 2007. Estimation and control of power electronic device temperature during operation with variable conducting current: Circuits, Devices & Systems, IET Circuits, Devices & Systems, IET. 1(2), 111-116
• MUSALLAM, MAHERA, BUTTAY, CYRIL, JOHNSON, C MARK, BAILEY, CHRIS and WHITEHEAD, MICHAEL, 2007. Reduced Order Electro-Thermal Models for Real-Time Health Management of Power Electronics In: International Conference on Thermal, Mechanical and Multi-Physics Simulation Experiments in Microelectronics and Micro-Systems, 2007. EuroSime 2007. 1-6
• JOHNSON, C. M., BUTTAY, C., RASHID, S. J., UDREA, F., AMARATUNGA, G. A. J., IRELAND, P. and MALHAN, R. K., 2007. Compact Double-Side Liquid-Impingement-Cooled Integrated Power Electronic Module: Power Semiconductor Devices and IC's, 2007. ISPSD '07. 19th International Symposium on In: Power Semiconductor Devices and IC's, 2007.ISPSD '07.19th International Symposium on,. 53-56
• BUTTAY, C, JOHNSON, M, MUSALLAM, M and WHITEHEAD, M, 2007. Real-Time Compact Electronic Thermal Modelling for Health Monitoring In: EPE 2007: 12th European Conference on Power Electronics and Applications.
• BUTTAY, C., RASHID, J., JOHNSON, C.M., UDREA, F., AMARATUNGA, G., IRELAND, P. and MALHAN, R.K, 2007. Compact Inverter Designed for High-Temperature Operation In: Power Electronics Specialists Conference, 2007. PESC 2007. IEEE. 2241-2247
• BUTTAY, C, RASHID, J, MALHAN, R.K., JOHNSON, M, UDREA, F, IRELAND, P and AMARATUNGA, G, 2007. High performance cooling system for automotive inverters In: EPE 2007: 12th European Conference on Power Electronics and Applications. (In Press.)
• ATKINSON, DAVID, ARMSTRONG, MATTHEW, JOHNSON, MARK and LAKIN, TONY, 2007. Grid Connected Converter Control In: IET Power Convention, 2007. 1-21
• VASSILEVSKI, K.V., NIKITINA, I.P., WRIGHT, N.G., HORSFALL, A.B., O'NEILL A.G. and JOHNSON, C.M., 2006. Device processing and characterisation of high temperature silicon carbide Schottky diodes Microelectronic Engineering. 83(1), 150-154
• WHITEHEAD, M. J. and JOHNSON, C. M., 2006. Junction Temperature Elevation as a Result of Thermal Cross Coupling in a Multi-Device Power Electronic Module In: Electronics Systemintegration Technology Conference, 2006.1st. 1218-1223
• ARMSTRONG, M., ATKINSON, D. J., JOHNSON, C. M. and ABEYASEKERA, T. D., 2006. Auto-Calibrating DC Link Current Sensing Technique for Transformerless, Grid Connected, H-Bridge Inverter Systems Power Electronics, IEEE Transactions on. 21, 1385-1393
• ADACHI, K., TAKAO, K., OHASHI, H. and JOHNSON, C. M., 2006. Elucidation of the intrinsic loss arising from switch output capacitance coss in ultra-high-speed low-loss power converters Circuits, Devices and Systems, IEE Proceedings-. 153, 40-45
• FORREST, S. J., WANG, J., JEWELL, G. W., JOHNSON, C. M. and CALVERLEY, S. D., 2006. Analysis of an AC fed direct converter for a switched reluctance machine in aerospace applications In: Power Electronics and Motion Control Conference, 2006.IPEMC '06.CES/IEEE 5th International,. 1-6
• ABEYASEKERA, T., JOHNSON, C.M., ATKINSON, D.J. and ARMSTRONG, M, 2005. Suppression of line voltage related distortion in current controlled grid connected inverters IEEE Transactions on Power Electronics. 20(6), 1393-1401
• ARMSTRONG, M., ATKINSON, D. J., JOHNSON, C. M. and ABEYASEKERA, T. D., 2005. Low order harmonic cancellation in a grid connected multiple inverter system via current control parameter randomization Power Electronics, IEEE Transactions on. 20, 885-892
• PRITCHARD, L.S., ACARNLEY, P.P. and JOHNSON, C.M., 2004. Effective thermal conductivity of porous solder layers IEEE Transactions on Components and Packaging Technologies. 27(2), 259-267
• GLEW, J.P., FORSYTH, A.J., WESTMANCOTT, O.J., WALLACE, W.F., JOHNSON, C.M., NAYLOR, P. and CLARE, J.C., 2001. Masters Level Training in Power Electronics Machines and Drives by Flexible Learning In: EPE Conference: Tomorrow''s Education in Electrical Technologies: Revisited Method and Tools for Renewed Motivation.
• GLEW, J.P., FORSYTH, A.J., WESTMANCOTT, O.J., WALLACE, W.F., JOHNSON, C.M., NAYLOR, P. and CLARE, J.C., 2001. Creation of Web Based Learning Materials for an MSc in Power Electronics and Drives In: Proceedings of the European Conference on Power Electronics and Applications EPE 2001.
• MUSALLAM, M., JOHNSON, C.M., CHUNYAN YIN, HUA LU and BAILEY, C., In-service life consumption estimation in power modules In: EPE 2008.
• DAI, J., LI, JIANFENG, AGYAKWA, P., CORFIELD, M. and JOHNSON, C.M., Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments during Power Cycling IEEE Transactions on Device and Materials Reliability.
• MOUAWAD, B., ESPINA, J., LI, JIANFENG, EMPRINGHAM, L. and JOHNSON, M., Novel Silicon Carbide Integrated Power Module for EV application In: WiPDA 2018 - IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia.